X-ray fluoroscopy equipment - Company Ranking(4 companies in total)
Last Updated: Aggregation Period:Nov 12, 2025〜Dec 09, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Body dimensions: 350W × 450D × 550H mm Body weight: Approximately 80kg Table size: 160 × 130mm Target dimensions: Maximum L100 × W100m... | - BGA shape inspection assist - BGA void display assist - Mounting board point height inspection - Large area double-sided board copper foil... | ||
| Body dimensions: 350W × 450D × 550H mm Body weight: Approximately 80kg Table size: 160 × 130mm Target dimensions: Maximum L100 × W100m... | - BGA shape inspection assist - BGA void display assist - Mounting board point height inspection - Large area double-sided board copper foil... | ||
| 【Overview】 ■ Independently developed a device to remove components from printed circuit boards with pre-installed parts and to cut each laye... | For more details, please refer to the PDF document or feel free to contact us. | ||
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- Featured Products
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X-ray fluoroscopy device (X-ray inspection device) "FLEX-M345"
- overview
- Body dimensions: 350W × 450D × 550H mm Body weight: Approximately 80kg Table size: 160 × 130mm Target dimensions: Maximum L100 × W100m...
- Application/Performance example
- - BGA shape inspection assist - BGA void display assist - Mounting board point height inspection - Large area double-sided board copper foil...
X-ray fluoroscopy device (X-ray inspection device) "FLEX-M345"
- overview
- Body dimensions: 350W × 450D × 550H mm Body weight: Approximately 80kg Table size: 160 × 130mm Target dimensions: Maximum L100 × W100m...
- Application/Performance example
- - BGA shape inspection assist - BGA void display assist - Mounting board point height inspection - Large area double-sided board copper foil...
[Application Example] Multi-layer Printed Circuit Board Pattern Analysis Technology through Substrate Cutting
- overview
- 【Overview】 ■ Independently developed a device to remove components from printed circuit boards with pre-installed parts and to cut each laye...
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
-
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